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IPB110P06LMATMA1 - Infineon

Description: MOSFET TRENCH 40<-<100V

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PCB Footprints
IPB110P06LMATMA1 - Infineon PCB footprint - Other - Other - PG-TO263-3_FFW
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3D Models
IPB110P06LMATMA1 - Infineon  - 3D model - Other - PG-TO263-3_FFW
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IPB110P06LMATMA1 Details

  • Manufacturer Part Number:

    IPB110P06LMATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Austria, Malaysia, Mexico

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    1616 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.011 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    260 pF

  • JEDEC-95 Code:

    TO-263

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPB110P06LMATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPB110P06LMATMA1 is -40°C to 150°C.
  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the device, and connecting it to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device.
  • Handle the device by the body, not the leads, to prevent damage. Avoid touching the leads or any other exposed metal parts to prevent electrostatic discharge (ESD) damage.
  • Yes, the IPB110P06LMATMA1 is suitable for high-reliability applications, such as automotive and industrial systems, due to its robust design and manufacturing process.

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IPB110P06LMATMA1 Overview

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