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IPB180N10S4-02 - Infineon

Description: MOSFET N-Ch 100V 180A D2PAK-6

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IPB180N10S4-02 - Infineon PCB footprint - Other - Other - IPB180N10S4-02-1
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IPB180N10S4-02 Details

  • Manufacturer Part Number:

    IPB180N10S4-02

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Avalanche Energy Rating (Eas):

    1110 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    180 A

  • Drain-source On Resistance-Max:

    0.0025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263

  • JESD-30 Code:

    R-PSSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    720 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPB180N10S4-02 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPB180N10S4-02 is -40°C to 150°C.
  • The recommended gate resistor value for the IPB180N10S4-02 is between 10 ohms to 100 ohms, depending on the specific application and switching frequency.
  • Yes, the IPB180N10S4-02 is suitable for high-reliability applications, such as automotive and industrial systems, due to its robust design and high-quality manufacturing process.
  • The maximum allowed voltage for the IPB180N10S4-02 is 100V, with a maximum repetitive peak voltage of 120V.
  • To ensure proper cooling, it is recommended to provide a heat sink with a thermal resistance of less than 10°C/W, and to ensure good airflow around the device.

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