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IPB80P03P4L-04 - Infineon

Description: Infineon IPB80P03P4L-04 P-channel MOSFET Transistor, 80 A, -30 V, 3-Pin TO-263

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IPB80P03P4L-04 - Infineon PCB footprint - Other - Other - IPB80P03P4L-04-2
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IPB80P03P4L-04 Details

  • Manufacturer Part Number:

    IPB80P03P4L-04

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    410 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.0067 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    130 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    137 W

  • Pulsed Drain Current-Max (IDM):

    320 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPB80P03P4L-04 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPB80P03P04L-04 is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal design and layout guidelines, and to implement adequate cooling mechanisms to keep the junction temperature within the specified range.
  • The recommended PCB layout involves using a multi-layer board with a solid ground plane, placing the IPB80P03P4L-04 near the power source, and using shielded cables and connectors to minimize EMI.
  • To protect the IPB80P03P4L-04, use overvoltage protection (OVP) and overcurrent protection (OCP) circuits, and ensure that the device is operated within the specified voltage and current ratings.
  • Store the IPB80P03P4L-04 in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins, and use anti-static wrist straps and mats to prevent electrostatic discharge (ESD) damage.

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IPB80P03P4L-04 Overview

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