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IPD031N03LGATMA1 - Infineon

Description: Trans MOSFET N-CH 30V 90A 3-Pin(2+Tab) DPAK T/R

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PCB Footprints
IPD031N03LGATMA1 - Infineon PCB footprint - Other - Other - PG-TO252-3_2.41H
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3D Models
IPD031N03LGATMA1 - Infineon  - 3D model - Other - PG-TO252-3_2.41H
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IPD031N03LGATMA1 Details

  • Manufacturer Part Number:

    IPD031N03LGATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    GREEN, PLASTIC PACKAGE-3

  • Pin Count:

    4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    60 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    90 A

  • Drain-source On Resistance-Max:

    0.004 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPD031N03LGATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IPD031N03LGATMA1 is -40°C to 150°C.
  • To ensure reliability, it is recommended to follow the recommended operating conditions, use a proper thermal management system, and consider derating the device's power handling capabilities at high temperatures.
  • The recommended PCB layout and thermal design for the IPD031N03LGATMA1 involves using a multi-layer PCB with a solid ground plane, placing thermal vias under the device, and using a heat sink or thermal interface material to dissipate heat.
  • To protect the IPD031N03LGATMA1 from ESD, it is recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design.
  • The recommended gate drive circuits for the IPD031N03LGATMA1 involve using a dedicated gate driver IC, such as the Infineon 1EDC or 2EDC family, and following the recommended circuit topology and component selection guidelines.

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IPD031N03LGATMA1 Overview

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