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IPD30N06S223ATMA2 - Infineon

Description: MOSFETs MOSFET_)40V 60V)

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IPD30N06S223ATMA2 - Infineon  - 3D model
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IPD30N06S223ATMA2 Details

  • Manufacturer Part Number:

    IPD30N06S223ATMA2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    150 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.023 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    120 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPD30N06S223ATMA2 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPD30N06S223ATMA2 is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • Proper cooling is crucial for the device's reliability and performance. Ensure good thermal contact between the device and the heat sink, and use a thermal interface material (TIM) if necessary. The device's thermal resistance (RthJA) is specified in the datasheet, and you can use this value to calculate the required heat sink size and thermal interface material.
  • For optimal performance and to minimize electromagnetic interference (EMI), follow these PCB layout guidelines: keep the device's pins as short as possible, use a solid ground plane, and place decoupling capacitors close to the device. Additionally, ensure the PCB material has a high thermal conductivity to aid in heat dissipation.
  • Yes, the IPD30N06S223ATMA2 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is designed to withstand harsh environmental conditions. However, you should consult with Infineon's application engineers to ensure the device meets your specific application requirements.
  • The IPD30N06S223ATMA2 is sensitive to electrostatic discharge (ESD). Handle the device with care, using ESD-protective equipment and following proper ESD handling procedures. Ensure the device is properly grounded during assembly and testing, and use ESD-protective packaging during storage and transportation.

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IPD30N06S223ATMA2 Overview

Use the download button to access the IPD30N06S223ATMA2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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