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IPD50N06S4L08ATMA2 - Infineon

Description: INFINEON - IPD50N06S4L08ATMA2 - Power MOSFET, N Channel, 60 V, 50 A, 0.0063 ohm, TO-252 (DPAK), Surface Mount

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IPD50N06S4L08ATMA2 - Infineon PCB footprint - Other - Other - PG-TO252 -3_ffw
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IPD50N06S4L08ATMA2 - Infineon  - 3D model - Other - PG-TO252 -3_ffw
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IPD50N06S4L08ATMA2 Details

  • Manufacturer Part Number:

    IPD50N06S4L08ATMA2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252-3-11, 3/2 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    87 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.0078 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

IPD50N06S4L08ATMA2 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for IPD50N06S4L08ATMA2 is -55°C to 150°C.
  • To minimize switching losses, ensure the gate-source voltage (Vgs) is within the recommended range (typically 10-15V), and use a gate driver with a low output impedance to reduce ringing and oscillations.
  • To minimize parasitic inductance and capacitance, use a compact PCB layout with short, wide traces, and place the MOSFET close to the driver IC. Avoid using vias under the MOSFET, and use a solid ground plane to reduce inductance.
  • To handle thermal management, ensure good heat sinking, use a thermal interface material (TIM) between the MOSFET and heat sink, and consider using a heat sink with a high thermal conductivity. Monitor the junction temperature (Tj) and adjust the thermal design accordingly.
  • The IPD50N06S4L08ATMA2 has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and storage. Use an ESD wrist strap or mat, and store the devices in anti-static packaging.

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IPD50N06S4L08ATMA2 Overview

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Part Image IPD50N06S4L08ATMA1 Infineon Technologies AG

Power Field-Effect Transistor, 50A I(D), 60V, 0.0078ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252