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IPD65R600E6 - Infineon

Description: Infineon IPD65R600E6 N-channel MOSFET Transistor, 7.3 A, 700 V, 3-Pin TO-252

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IPD65R600E6 - Infineon PCB footprint - Other - Other - PG - TO252
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IPD65R600E6 Details

  • Manufacturer Part Number:

    IPD65R600E6

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-252

  • Package Description:

    GREEN, PLASTIC PACKAGE-3

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    142 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    7.3 A

  • Drain-source On Resistance-Max:

    0.6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    63 W

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPD65R600E6 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a large copper area for heat dissipation is recommended. The device should be placed near a heat sink or a metal plate for optimal thermal performance.
  • Ensure proper heat sinking, use a thermally conductive material, and follow the recommended PCB layout. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage transient on the drain-source voltage is 650V, but it's recommended to keep it below 600V to ensure reliable operation and prevent damage to the device.
  • Use a fuse or a current limiter to protect against overcurrent. For overvoltage protection, use a voltage clamp or a transient voltage suppressor (TVS) diode. Also, ensure that the device is operated within the recommended voltage and current ratings.
  • The recommended gate drive voltage is 15V, and the recommended gate drive current is 1A to 2A. However, the actual values may vary depending on the specific application and requirements.

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IPD65R600E6 Overview

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