Part Image

IPD80R1K4P7ATMA1 - Infineon

Description: Trans MOSFET N 800V 4A 3-Pin TO-252 T/R

Download IPD80R1K4P7ATMA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IPD80R1K4P7ATMA1 - Infineon PCB footprint - Other - Other - DPAK
click to zoom

IPD80R1K4P7ATMA1 Details

  • Manufacturer Part Number:

    IPD80R1K4P7ATMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2018-02-09

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    8 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    8.9 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPD80R1K4P7ATMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a heat sink or thermal interface material. Also, follow the recommended operating conditions and derating guidelines.
  • A gate drive circuit with a high current capability (e.g., 1A to 2A) and a fast rise/fall time (e.g., <10ns) is recommended. A dedicated gate driver IC or a discrete transistor-based design can be used.
  • Use a TVS diode or a zener diode for overvoltage protection. For overcurrent protection, consider using a current sense resistor and a comparator or a dedicated overcurrent protection IC.
  • A dead time of 100ns to 200ns is recommended to ensure proper switching and to prevent shoot-through currents. The exact dead time may vary depending on the specific application and switching frequency.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IPD80R1K4P7ATMA1 Overview

Use the download button to access the IPD80R1K4P7ATMA1 schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like IPD80, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IPD80R1K4P7ATMA1

Showing 0 results