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IPD80R600P7ATMA1 - Infineon

Description: Power MOSFET, N Channel, 800 V, 8 A, 0.51 ohm, TO-252 (DPAK), Surface Mount

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IPD80R600P7ATMA1 - Infineon PCB footprint - Other - Other - PG-TO252-3-341_2025
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IPD80R600P7ATMA1 - Infineon  - 3D model - Other - PG-TO252-3-341_2025
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IPD80R600P7ATMA1 Details

  • Manufacturer Part Number:

    IPD80R600P7ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain Current-Max (ID):

    8 A

  • Drain-source On Resistance-Max:

    0.6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    60 W

  • Pulsed Drain Current-Max (IDM):

    22 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPD80R600P7ATMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure good heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure good airflow around the device, and consider using a heat sink or thermal interface material to improve heat transfer. The device's thermal pad should be connected to a solid ground plane on the PCB to aid heat dissipation.
  • The maximum allowed voltage on the gate driver output is 15 V, with a maximum transient voltage of 18 V for a duration of 100 ns.
  • Use a fuse or a current sense resistor to detect overcurrent conditions, and consider adding overvoltage protection devices such as TVS diodes or Zener diodes to protect the device from voltage transients.
  • The recommended gate resistance is between 1 ohm and 10 ohms, depending on the specific application requirements and switching frequency.

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IPD80R600P7ATMA1 Overview

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Part Image IPD80R600P7 Infineon Technologies AG

Power Field-Effect Transistor, 8A I(D), 800V, 0.6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252