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IPS80R900P7AKMA1 - Infineon

Description: N-Channel 800 V 6A (Tc) 45W (Tc) Through Hole PG-TO251-3

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IPS80R900P7AKMA1 - Infineon - PCB symbol
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PCB Footprints
IPS80R900P7AKMA1 - Infineon PCB footprint - Other - Other - PG-TO251-3
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3D Models
IPS80R900P7AKMA1 - Infineon - 3D model - Other - PG-TO251-3
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IPS80R900P7AKMA1 Details

  • Manufacturer Part Number:

    IPS80R900P7AKMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    IPAK-3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    13 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain-source On Resistance-Max:

    0.9 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-251

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    14 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPS80R900P7AKMA1 Frequently Asked Questions (FAQs)

  • The IPS80R900P7AKMA1 can operate safely between -40°C to 150°C, but the recommended operating temperature range is -20°C to 125°C for optimal performance.
  • The IPS80R900P7AKMA1 has a thermal pad on the bottom of the package, which should be connected to a heat sink or a thermal interface material to ensure proper heat dissipation. A thermal resistance of less than 1°C/W is recommended.
  • A 2-layer or 4-layer PCB is recommended, with a solid ground plane on the bottom layer and a separate power plane for the device. Keep the decoupling capacitors close to the device and use a low-inductance path for the power supply.
  • The IPS80R900P7AKMA1 requires a controlled power-up and power-down sequence to prevent damage. The recommended sequence is: VCC, then VGS, then VIN. For power-down, reverse the sequence.
  • The IPS80R900P7AKMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure the workspace is ESD-safe.

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IPS80R900P7AKMA1 Overview

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