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IRAMX20UP60A - Infineon

Description: Power Driver Module IGBT 3 Phase 600 V 20 A 23-PowerSIP Module, 19 Leads, Formed Leads

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Symbol
IRAMX20UP60A - Infineon - PCB symbol
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PCB Footprints
IRAMX20UP60A - Infineon PCB footprint - Other - Other - 23-PowerSIP Module, 19 Leads, Formed Leads_2025
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3D Models
IRAMX20UP60A - Infineon - 3D model - Other - 23-PowerSIP Module, 19 Leads, Formed Leads_2025
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IRAMX20UP60A Details

  • Manufacturer Part Number:

    IRAMX20UP60A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SIP-23

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XZFM-T23

  • Number of Functions:

    1

  • Number of Terminals:

    23

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZIP

  • Package Equivalence Code:

    ZIP19/23,.2,.1,78FL

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    3.3 mA

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    12 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.98 mm

  • Terminal Position:

    ZIG-ZAG

IRAMX20UP60A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below 125°C.
  • A gate drive circuit with a low impedance output stage and a high current capability (e.g., > 1A) is recommended. The gate drive voltage should be set to 15V to ensure optimal switching performance.
  • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the device. The OVP circuit should be set to 60V, and the OCP circuit should be set to 20A.
  • A dead time of 100-200 ns is recommended to minimize shoot-through current. The dead time should be adjusted based on the specific application requirements and the device's switching frequency.

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IRAMX20UP60A Overview

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