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IRF7503PBF - Infineon

Description: INFINEON - IRF7503PBF - MOSFET, DUAL, NN, MICRO-8

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IRF7503PBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - Micro8
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IRF7503PBF - Infineon  - 3D model - Small Outline Packages - Micro8
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IRF7503PBF Details

  • Manufacturer Part Number:

    IRF7503PBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.4 A

  • Drain-source On Resistance-Max:

    0.135 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.39 W

  • Pulsed Drain Current-Max (IDM):

    14 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRF7503PBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRF7503PBF is -55°C to 175°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -40°C to 150°C for optimal performance and reliability.
  • To ensure proper biasing, make sure to provide a stable voltage supply to the gate-source voltage (Vgs) within the recommended range of 2V to 15V. Additionally, ensure the drain-source voltage (Vds) is within the specified range of 30V to 60V, and the drain current (Id) is within the recommended range of 10A to 20A.
  • For optimal thermal management, it's recommended to use a PCB with a thick copper layer (at least 2 oz) and a thermal pad connected to a heat sink or a thermal interface material. Ensure the PCB layout provides a low-inductance path for the drain and source pins, and keep the gate pin away from high-frequency signals to minimize noise coupling.
  • Yes, the IRF7503PBF is suitable for high-frequency switching applications up to 1 MHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure the gate drive circuitry is capable of providing a fast switching signal. Additionally, be mindful of the device's power losses and thermal management requirements at high frequencies.
  • To protect the IRF7503PBF from overvoltage and overcurrent conditions, use a voltage clamp or a zener diode to limit the voltage across the device. Additionally, consider using a current sense resistor and a comparator to detect overcurrent conditions and trigger a shutdown or fault protection mechanism.

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IRF7503PBF Overview

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Part Image IRF7503TRPBF Infineon Technologies AG

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