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IRFS4227TRLPBF - Infineon

Description: Infineon IRFS4227TRLPBF N-Channel MOSFET, 62 A, 200 V HEXFET, 3-Pin D2PAK

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IRFS4227TRLPBF - Infineon PCB footprint - Other - Other - D2PAK
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IRFS4227TRLPBF - Infineon  - 3D model - Other - D2PAK
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IRFS4227TRLPBF Details

  • Manufacturer Part Number:

    IRFS4227TRLPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.12

  • Avalanche Energy Rating (Eas):

    140 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    62 A

  • Drain-source On Resistance-Max:

    0.026 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    330 W

  • Pulsed Drain Current-Max (IDM):

    260 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFS4227TRLPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRFS4227TRLPBF is -40°C to 150°C.
  • To ensure reliability, follow proper thermal management, use a suitable heat sink, and ensure the device is operated within the recommended operating conditions.
  • Use a multi-layer PCB with a solid ground plane, keep high-frequency traces short and away from the device, and use shielding or filtering to minimize EMI.
  • Yes, the IRFS4227TRLPBF is suitable for high-frequency switching applications, but ensure the device is operated within the recommended switching frequency range and follow proper PCB layout guidelines.
  • Use overvoltage protection (OVP) and overcurrent protection (OCP) circuits, and ensure the device is operated within the recommended voltage and current ratings.

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