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IRG7PH42UPBF - Infineon

Description: Infineon IGBT IRG7PH42UPBF, 3-Pin TO-247AC 1200 V, 90 A

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PCB Footprints
IRG7PH42UPBF - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247AC Package Outline
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3D Models
IRG7PH42UPBF - Infineon  - 3D model - Transistor Outline, Vertical - TO-247AC Package Outline
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IRG7PH42UPBF Details

  • Manufacturer Part Number:

    IRG7PH42UPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Collector Current-Max (IC):

    90 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Fall Time-Max (tf):

    86 ns

  • Gate-Emitter Thr Voltage-Max:

    6 V

  • Gate-Emitter Voltage-Max:

    30 V

  • Operating Temperature-Max:

    175 °C

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    385 W

  • Rise Time-Max (tr):

    41 ns

  • Surface Mount:

    NO

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

IRG7PH42UPBF Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN-1071, which includes guidelines for thermal vias, copper thickness, and heat sink attachment.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable heat sink, and consider derating the device's power handling according to the temperature derating curve provided in the datasheet.
  • The IRG7PH42UPBF has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices if the application requires it.
  • Yes, the IRG7PH42UPBF is qualified according to AEC-Q101, making it suitable for automotive and high-reliability applications. However, ensure that the device is used within its recommended operating conditions and follow the manufacturer's guidelines for reliability and quality.
  • To troubleshoot issues, start by reviewing the application circuit and ensuring that it meets the recommended operating conditions. Check for proper heat sink attachment, thermal interface material, and PCB layout. Use oscilloscopes and thermal imaging tools to identify potential issues. Consult Infineon's application notes and technical support resources for further guidance.

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