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IRLML6302TRPBF - Infineon

Description: MOSFET MOSFT P-Ch -0.62A 600mOhm 2.4nC LogLvl

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IRLML6302TRPBF - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - Micro3™ (SOT-23)_
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3D Models
IRLML6302TRPBF - Infineon  - 3D model - SOT23 (3-Pin) - Micro3™ (SOT-23)_
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IRLML6302TRPBF Details

  • Manufacturer Part Number:

    IRLML6302TRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MICRO-3, SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.78 A

  • Drain-source On Resistance-Max:

    0.6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    28 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    0.54 W

  • Power Dissipation-Max (Abs):

    0.54 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRLML6302TRPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRLML6302TRPBF is -55°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and minimizing thermal resistance.
  • To minimize EMI, it's recommended to use a multi-layer PCB with a solid ground plane, keep the power traces short and wide, and use shielding or filtering components as needed.
  • Yes, the IRLML6302TRPBF is suitable for high-frequency switching applications up to 1 MHz, but it's essential to consider the device's switching characteristics, gate drive requirements, and PCB layout to minimize ringing and oscillations.
  • To protect the IRLML6302TRPBF from ESD, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the application.

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IRLML6302TRPBF Overview

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Part Image IRLML6302 International Rectifier

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For a full list of alternate parts for IRLML6302TRPBF, check out Findchips.com