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IRS2052MTRPBF - Infineon

Description: Audio Amplifiers Gen5 HVIC 200V 2Ch digital audio driver

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PCB Footprints
IRS2052MTRPBF - Infineon PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MLPQ 7X7
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3D Models
IRS2052MTRPBF - Infineon  - 3D model - Quad Flat No-Lead - MLPQ 7X7
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IRS2052MTRPBF Details

  • Manufacturer Part Number:

    IRS2052MTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-220, MLPQ-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

IRS2052MTRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection, over-voltage protection, and over-current protection to prevent damage and ensure reliable operation.
  • Use a gate drive circuit with a low impedance output stage, and ensure the gate drive voltage is within the recommended range. Optimize the gate resistance and capacitance for the specific application.
  • Use a shielded layout, minimize loop areas, and use a common mode choke to reduce EMI. Ensure the device is placed away from sensitive circuits and follow good EMC design practices.

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IRS2052MTRPBF Overview

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