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IRS20957SPBF - Infineon

Description: Infineon IRS20957SPBF Audio Amplifier IC, Class-D 800kHz, 16-Pin SOIC

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IRS20957SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SOIC16N
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IRS20957SPBF - Infineon  - 3D model - Small Outline Packages - SOIC16N
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IRS20957SPBF Details

  • Manufacturer Part Number:

    IRS20957SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-16

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.89 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    15 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

IRS20957SPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the IRS20957SPBF involves keeping the high-frequency switching nodes (e.g., drain-source voltage) away from sensitive analog circuits, using a solid ground plane, and minimizing loop areas in the power stage. Additionally, using a shielded inductor and placing it close to the IC can help reduce EMI.
  • To ensure the IRS20957SPBF operates within its SOA, implement a soft-start circuit to limit the inrush current during startup. During shutdown, use a controlled shutdown sequence to prevent voltage spikes and ensure the IC's internal voltage regulators are properly discharged.
  • For thermal management, ensure good airflow around the IC, use a heat sink with a thermal interface material, and consider using a thermal pad or thermal tape to improve heat transfer. Also, keep the IC's thermal pad connected to a solid ground plane to help dissipate heat.
  • To troubleshoot issues with the IRS20957SPBF, use an oscilloscope to monitor the IC's internal signals (e.g., VCC, VDD, and output voltage). Check for signs of oscillation, voltage drops, or excessive current. Verify the PCB layout, component selection, and soldering quality. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When using the IRS20957SPBF in a high-reliability or safety-critical application, consider implementing redundant circuits, using fault-tolerant design principles, and performing thorough failure mode and effects analysis (FMEA). Ensure compliance with relevant industry standards and regulations, such as IEC 61508 or ISO 26262.

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IRS20957SPBF Overview

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