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IS181B - Isocom

Description: OPTOISO 3.75KV TRANS MINI-FLAT

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IS181B - Isocom PCB footprint - Small Outline Packages - Small Outline Packages - MiniFlat
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IS181B - Isocom  - 3D model - Small Outline Packages - MiniFlat
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IS181B Details

  • Manufacturer Part Number:

    IS181B

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Isocom Components

  • YTEOL:

    6

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    130%

  • Current Transfer Ratio-Nom:

    130%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000018 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

IS181B Frequently Asked Questions (FAQs)

  • The recommended storage condition for IS181B is in a dry, cool place, away from direct sunlight, with a temperature range of -20°C to 40°C and humidity below 80%.
  • IS181B is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps, mats, and bags, to prevent damage from static electricity.
  • The maximum operating temperature range for IS181B is -40°C to 85°C. Operating outside this range may affect the device's performance and reliability.
  • While IS181B can operate in humid environments, it's recommended to use it in environments with a relative humidity below 80%. Higher humidity may affect the device's performance and reliability.
  • To ensure reliability in high-vibration applications, use a secure mounting method, such as screwing or adhesive bonding, and consider using a vibration-dampening material to reduce mechanical stress on the device.

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IS181B Overview

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