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ISL21010DFH310Z-T - Renesas Electronics

Description: The ISL21010 is a precision, low dropout micropower bandgap voltage reference in a space-saving SOT-23 package. It operates from a single 2.2V to 5.5V supply (minimum voltage is dependent on voltage option) and provides a ±0.2% accurate reference. The ISL21010 provides up to 25mA of output current sourcing with a low 150mV dropout voltage. Output voltage options include 1.024V, 1.2V, 1.5V, 2.048V, 2.5V, 3.0V, 3.3V, and 4.096V. The low supply current and low dropout voltage combined with high accuracy make t

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ISL21010DFH310Z-T - Renesas Electronics PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - P3.064-ren1
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ISL21010DFH310Z-T - Renesas Electronics  - 3D model - SOT23 (3-Pin) - P3.064-ren1
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ISL21010DFH310Z-T Details

  • Manufacturer Part Number:

    ISL21010DFH310Z-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    P3.064

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.025 A

  • Output Voltage-Max:

    1.026048 V

  • Output Voltage-Min:

    1.021952 V

  • Output Voltage-Nom:

    1.024 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temp Coef of Voltage-Max:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.2%

  • Width:

    1.3 mm

ISL21010DFH310Z-T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance can be found in the ISL21010 evaluation board user manual, which provides a detailed layout guide and Gerber files for reference. Additionally, Renesas provides a PCB layout checklist in the datasheet that highlights key considerations for layout design.
  • The ISL21010 requires a specific power-up sequence to ensure proper initialization. The datasheet provides a detailed power-up sequence diagram, and Renesas recommends following this sequence to ensure the device is properly powered up and initialized.
  • The ISL21010 has a maximum junction temperature of 150°C. To ensure reliable operation, Renesas recommends following proper thermal management practices, such as using a heat sink, thermal interface material, and ensuring good airflow around the device. The datasheet provides thermal resistance values and a thermal model to aid in thermal design.
  • Renesas provides a troubleshooting guide in the datasheet that covers common issues and their possible causes. Additionally, the ISL21010 evaluation board user manual provides a detailed troubleshooting section that covers common issues and their solutions. Renesas also offers technical support and application notes that can aid in troubleshooting.
  • Yes, the ISL21010 is a high-frequency device and requires proper EMI/EMC design considerations to ensure reliable operation. Renesas recommends following proper PCB layout practices, using shielding, and implementing filtering and decoupling to minimize EMI/EMC issues. The datasheet provides EMI/EMC guidelines and recommendations for design.

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