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ISL3171EIBZ - Renesas Electronics

Description: The Renesas ISL317xE are ±15kV IEC61000 ESD protected, 3. 3V powered single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125µA/-100µA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification's 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are r

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ISL3171EIBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8-15
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ISL3171EIBZ - Renesas Electronics  - 3D model - Small Outline Packages - M8-15
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ISL3171EIBZ Details

  • Manufacturer Part Number:

    ISL3171EIBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7.2

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    120 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1500 ns

  • Width:

    3.9 mm

ISL3171EIBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3171EIBZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to minimize the length of the traces between the device and the capacitors.
  • To ensure reliable operation over the full temperature range, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques such as heat sinks or thermal pads to keep the device within its specified temperature range.
  • Using a lower voltage supply than the recommended 3.3V may result in reduced performance, increased power consumption, and potential reliability issues. Using a higher voltage supply may exceed the device's absolute maximum ratings, leading to damage or failure. It's recommended to use a voltage supply within the specified range for optimal performance and reliability.
  • To troubleshoot issues with the I2C interface, start by verifying the clock frequency and signal integrity. Check for proper termination, pull-up resistors, and signal levels. Use an oscilloscope or logic analyzer to monitor the SCL and SDA lines for errors or bus contention. Consult the datasheet and application notes for specific guidance on I2C interface troubleshooting.
  • The ISL3171EIBZ has built-in ESD protection diodes on all pins, which can withstand up to 2kV of ESD voltage. To prevent latch-up, it's essential to follow proper PCB design and layout guidelines, including using a solid ground plane and minimizing the length of traces between the device and capacitors. Additionally, ensure that the device is powered up and down slowly to prevent voltage spikes.

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ISL3171EIBZ Overview

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