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ISL3178EIBZ - Renesas Electronics

Description: The Renesas ISL317xE are ±15kV IEC61000 ESD protected, 3. 3V powered single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125µA/-100µA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification's 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are r

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ISL3178EIBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15-ren2
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ISL3178EIBZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.15-ren2
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ISL3178EIBZ Details

  • Manufacturer Part Number:

    ISL3178EIBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    60 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    40 ns

  • Width:

    3.9 mm

ISL3178EIBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3178EIBZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down of the ISL3178EIBZ, make sure to follow the recommended power-up sequence, which is to apply VCC first, followed by VDD. During power-down, remove VDD first, followed by VCC. Also, ensure that the input voltage ramps up and down slowly to prevent latch-up.
  • The maximum capacitance value that can be used with the ISL3178EIBZ is 10uF. Using a capacitance value higher than this may cause instability or oscillations in the device.
  • To troubleshoot issues with the ISL3178EIBZ, start by verifying the power supply voltages and ensuring that the device is properly powered up and powered down. Check the input and output signals using an oscilloscope to identify any anomalies. Also, review the PCB layout and ensure that it follows the recommended layout guidelines.
  • The ISL3178EIBZ is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If operation in a high-temperature environment is required, ensure that the device is properly heat-sinked and that the PCB is designed to handle the increased thermal stress.

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ISL3178EIBZ Overview

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