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ISL32172EFVZ - Renesas Electronics

Description: The ISL32172E, ISL32272E, ISL32174E, and ISL32179E are ±16. 5kV IEC61000-4-2 ESD protected, 3. 0V to 5. 5V powered, QUAD transmitters for balanced communication using the RS-422 standard. These drivers have very low output leakage currents (±10µA), so they present a low load to the RS-422 bus. The driver (Tx) outputs are tri-statable and incorporate a hot plug feature to keep them disabled during power-up and power-down. The ISL32172E and ISL32272E have a common EN/EN, the ISL32174E has a two channel EN12/E

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ISL32172EFVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - MDP0044 TSSOP-16
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ISL32172EFVZ - Renesas Electronics  - 3D model - Small Outline Packages - MDP0044 TSSOP-16
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ISL32172EFVZ Details

  • Manufacturer Part Number:

    ISL32172EFVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.173

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-10

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    CAN ALSO OPERATE FROM VCC=3 TO 3.6V

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00003 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    15 ns

  • Width:

    4.4 mm

ISL32172EFVZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL32172EFVZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the device operates within the specified temperature range, it's essential to provide adequate heat sinking, especially in high-power applications. A thermal pad on the bottom of the package can be connected to a heat sink or a thermal plane on the PCB to dissipate heat efficiently.
  • To prevent damage, handle the device by the body and not the pins, use an anti-static wrist strap or mat, and avoid touching the pins or any exposed internal components. It's also recommended to store the device in an anti-static bag or wrap it in anti-static material when not in use.
  • To troubleshoot issues with the ISL32172EFVZ, start by verifying the power supply voltage and ensuring it's within the specified range. Check the input and output signals for any anomalies, and use an oscilloscope to monitor the signals. If the issue persists, consult the datasheet and application notes, and contact Renesas support if necessary.
  • To minimize EMI and RFI when using the ISL32172EFVZ, use a shielded enclosure, keep the device away from antennas and other EMI sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, ensure the PCB layout is optimized for EMI reduction, and use EMI-absorbing materials if necessary.

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ISL32172EFVZ Overview

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