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ISL32273EFVZ - Renesas Electronics

Description: These Renesas devices are ±16. 5kV IEC61000-4-2 ESD protected, 3. 0V to 5. 5V powered, quad receivers for balanced communication using the RS-485 and RS-422 standards. Each receiver has low input currents (±200μA), so it presents a 1/4 unit load to the RS-485 bus and allows up to 128 receivers on the bus. The ISL32173E and ISL32177E are high data rate receivers that operate at data rates up to 80Mbps. Their 8ns maximum propagation delay skew (tolerance) ensures excellent part-to-part matching. The ISL32273E

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ISL32273EFVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 16 Ld TSSOP*1
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ISL32273EFVZ - Renesas Electronics  - 3D model - Small Outline Packages - 16 Ld TSSOP*1
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ISL32273EFVZ Details

  • Manufacturer Part Number:

    ISL32273EFVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    MDP0044

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Additional Feature:

    LOGIC SUPPLY RANGING FROM 1.6 TO 5.5 IS AVAILABLE

  • Differential Output:

    NO

  • High Level Input Current-Max:

    0.000015 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    55 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL32273EFVZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, wide traces for power and ground connections.
  • Ensure proper thermal design, including heat sinking and airflow. Use a thermally conductive material for the PCB and consider using a heat sink or thermal interface material. Follow the recommended operating conditions and derating guidelines.
  • The ISL32273EFVZ has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures. Use an ESD wrist strap or mat, and store the devices in anti-static packaging.
  • While the ISL32273EFVZ is designed for isolated applications, it can be used in non-isolated applications with proper design considerations. However, this may compromise the device's isolation performance and safety features.
  • Use an oscilloscope to measure the output voltage and current. Check for proper PCB layout, decoupling, and filtering. Ensure that the input voltage is within the recommended range and that the device is properly configured.

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ISL32273EFVZ Overview

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