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ISL32277EFRZ - Renesas Electronics

Description: These Renesas devices are ±16. 5kV IEC61000-4-2 ESD protected, 3. 0V to 5. 5V powered, quad receivers for balanced communication using the RS-485 and RS-422 standards. Each receiver has low input currents (±200μA), so it presents a 1/4 unit load to the RS-485 bus and allows up to 128 receivers on the bus. The ISL32173E and ISL32177E are high data rate receivers that operate at data rates up to 80Mbps. Their 8ns maximum propagation delay skew (tolerance) ensures excellent part-to-part matching. The ISL32273E

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ISL32277EFRZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L24.4x4C-
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ISL32277EFRZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - L24.4x4C-
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ISL32277EFRZ Details

  • Manufacturer Part Number:

    ISL32277EFRZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    QFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    L24.4X4C

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    LOGIC SUPPLY RANGING FROM 1.6 TO 5.5 IS AVAILABLE

  • Differential Output:

    NO

  • High Level Input Current-Max:

    0.000015 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    S-PQCC-N24

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    55 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ISL32277EFRZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, wide traces for power and ground connections.
  • Ensure proper thermal design, including heat sinking and airflow. Use a thermally conductive material for the PCB and consider using a heat sink or thermal interface material. Follow the recommended operating conditions and derating guidelines.
  • The ISL32277EFRZ has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the PCB is properly grounded.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply voltage, clock frequency, and data transmission rates. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls.
  • Follow the recommended design and layout guidelines, and ensure that the device is operated within its specified temperature range. Consider using redundant or fault-tolerant designs, and follow relevant industry standards and regulations (e.g., IEC 61508 or DO-254).

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