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ISL3259EIBZ - Renesas Electronics

Description: The ISL3259E is a ±15kV IEC61000 ESD Protected, 5V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. It also features the larger output voltage and higher data rate (up to 100Mbps) required by high speed PROFIBUS applications. The low bus currents (+220μA/-150μA) present a 1/5 unit load to the RS-485 bus. This allows up to 160 transceivers on the network without violating the RS-485 specification’s load limit, and without using repeaters. This transceive

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ISL3259EIBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15-ren4
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ISL3259EIBZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.15-ren4
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ISL3259EIBZ Details

  • Manufacturer Part Number:

    ISL3259EIBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.9 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.01 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    13 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.25 V

  • Supply Voltage1-Min:

    4.75 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    10 ns

  • Width:

    3.9 mm

ISL3259EIBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3259EIBZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to place the device close to the signal sources and to use a low-ESR capacitor for the VCC pin.
  • The ISL3259EIBZ requires a single 3.3V or 5V power supply. It's recommended to power the device with a low-noise, low-dropout regulator. The power sequencing requirement is to power up the VCC pin before the SCL and SDA pins.
  • The ISL3259EIBZ supports cable lengths up to 100 meters, depending on the cable quality and the baud rate. However, it's recommended to use a repeater or a signal conditioner for longer cable lengths to ensure signal integrity.
  • To troubleshoot communication issues, check the signal integrity on the SCL and SDA lines using an oscilloscope. Verify that the device is properly powered and that the clock frequency is within the specified range. Also, check for any bus contention or conflicts with other devices on the bus.
  • The ISL3259EIBZ has a thermal pad on the bottom of the package, which should be connected to a solid ground plane on the PCB to dissipate heat. It's also recommended to use a thermal interface material to improve heat transfer between the device and the PCB.

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ISL3259EIBZ Overview

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