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ISL3331IRZ-T - Renesas Electronics

Description: This device is a BiCMOS interface IC that is user-configured as either a single RS-422/RS-485 differential transceiver or as a dual (2 Tx, 2 Rx) RS-232 transceiver. In RS-232 mode, the on-board charge pump generates RS-232 compliant ±5V Tx output levels, from a supply as low as 3.15V. Four small 0.1µF capacitors are required for the charge pump. The transceivers are RS-232 compliant, with the Rx inputs handling up to ±25V. In RS-485 mode, the transceivers support both the RS-485 and RS-422 differential comm

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ISL3331IRZ-T - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 40 Ld 6x6 QFN-
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ISL3331IRZ-T - Renesas Electronics  - 3D model - Quad Flat No-Lead - 40 Ld 6x6 QFN-
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ISL3331IRZ-T Details

  • Manufacturer Part Number:

    ISL3331IRZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    QFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    L40.6X6

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-13

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    120 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.45 V

  • Supply Voltage-Min:

    3.15 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.45 V

  • Supply Voltage1-Min:

    3.15 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2000 ns

  • Width:

    6 mm

ISL3331IRZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL3331IRZ-T involves keeping the input and output traces short and wide, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and power-down of the ISL3331IRZ-T, it's recommended to follow a controlled power-up sequence, where the input voltage is ramped up slowly (typically 10-20 ms) to prevent inrush currents. During power-down, the input voltage should be ramped down slowly as well.
  • The ISL3331IRZ-T has a thermal pad that should be connected to a solid ground plane to dissipate heat efficiently. Additionally, the device should be placed in a well-ventilated area, and the PCB should be designed to minimize thermal resistance. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.
  • To troubleshoot issues with the ISL3331IRZ-T, start by verifying the input voltage and current, and checking for any signs of overheating. Use an oscilloscope to check the output voltage and current waveforms, and verify that the device is operating within its specified parameters. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • To minimize EMI and EMC issues with the ISL3331IRZ-T, use a shielded enclosure, and ensure that the PCB is designed with EMI reduction in mind (e.g., using a solid ground plane, minimizing trace lengths, and using EMI filters). Additionally, follow proper PCB layout and routing guidelines, and use EMI-absorbing materials if necessary.

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ISL3331IRZ-T Overview

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