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ISL33354EIAZ - Renesas Electronics

Description: The ISL33354E, ISL33357E are two port interface ICs where port 1 is configured as a dual (2 Tx, 2 Rx) RS-232 transceiver, and port 2 is a single RS-485/422 transceiver. An on-board charge pump generates RS-232 compliant ±5V Tx output levels from a single VCC supply as low as 4. 5V. The transceivers are RS-232 compliant, with the Rx inputs handling up to ±25V. The port 2 transceiver supports both the RS-485 and RS-422 differential communication standards. The receiver features full fail-safe operation, so th

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ISL33354EIAZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M28.209
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ISL33354EIAZ - Renesas Electronics  - 3D model - Small Outline Packages - M28.209
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ISL33354EIAZ Details

  • Manufacturer Part Number:

    ISL33354EIAZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP, SSOP28,.3

  • Pin Count:

    28

  • Manufacturer Package Code:

    M28.209

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-13

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Differential Output:

    YES

  • Driver Number of Bits:

    3

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; EIA-485

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2 V

  • Output Low Current-Max:

    0.003 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    120 ns

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    7 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2000 ns

  • Width:

    5.3 mm

ISL33354EIAZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, direct traces for the input and output signals, and avoid crossing signal lines.
  • Ensure good thermal conductivity by using a heat sink or a thermal pad on the exposed pad of the QFN package. Keep the device away from heat sources and ensure good airflow around the device.
  • The recommended input capacitance value is 10nF to 100nF, and the recommended output capacitance value is 10uF to 100uF. However, the optimal value may vary depending on the specific application and layout.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines. Ensure that the ESD protection devices are rated for the maximum voltage and current of the application.
  • Power up the device in the following sequence: VCC, then VIN. Power down the device in the reverse sequence: VIN, then VCC. Ensure that the power supplies are stable and within the specified voltage range before applying them to the device.

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