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ISL55014IEZ-T7 - Renesas Electronics

Description: The ISL55014 is a high performance gain block featuring a Darlington configuration using high fT transistors and excellent thermal performance. They are an ideal choice for DVB-S LNB cable receiver applications. Other members of the family includes: • ISL55012 and ISL55015 match a 75Ω source to a 50Ω load. • ISL55013 and ISL55014 match a 50Ω source to a 50Ω load.

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ISL55014IEZ-T7 - Renesas Electronics - PCB symbol
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PCB Footprints
ISL55014IEZ-T7 - Renesas Electronics PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - (SC70-6)-1
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3D Models
ISL55014IEZ-T7 - Renesas Electronics - 3D model - SOT23 (6-Pin) - (SC70-6)-1
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ISL55014IEZ-T7 Details

  • Manufacturer Part Number:

    ISL55014IEZ-T7

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC70

  • Pin Count:

    6

  • Manufacturer Package Code:

    P6.049B

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

ISL55014IEZ-T7 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 10uF) close to the device.
  • Ensure the power supply voltage (VCC) is within the recommended range (2.7V to 5.5V). Apply power to VCC before applying an input signal. Configure the device by setting the appropriate pin states (e.g., EN, SHDN) and capacitor values (e.g., CIN, COUT).
  • The maximum input signal amplitude is 5Vpp, and the maximum frequency is 100 kHz. Exceeding these limits may cause distortion, clipping, or damage to the device.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Ensure good PCB layout practices, such as minimizing trace lengths and using a solid ground plane.
  • Use a heat sink with a thermal conductivity of at least 1 W/m-K. Ensure good airflow around the device. Consider using a thermal interface material (TIM) between the device and heat sink. Monitor the junction temperature (TJ) and ensure it stays below the maximum rating (150°C).

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ISL55014IEZ-T7 Overview

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