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ISL71010BMB25Z - Renesas Electronics

Description: The ISL71010B25 is an ultra-low noise, high DC accuracy precision voltage reference with a wide input voltage range from 4V to 30V. The ISL71010B25 uses the dielectrically isolated PR40 process to achieve 1.9μVP-P noise at 0.1Hz to 10Hz with an initial voltage accuracy of ±0. 05%. The ISL71010B25 offers a 2.5V output voltage with 10ppm/°C temperature coefficient and also provides excellent line and load regulation. The device is offered in an 8 Ld SOIC package. The ISL71010B25 is ideal for high-end instrume

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ISL71010BMB25Z - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (8 LD SOIC)
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ISL71010BMB25Z - Renesas Electronics  - 3D model - Small Outline Packages - (8 LD SOIC)
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ISL71010BMB25Z Details

  • Manufacturer Part Number:

    ISL71010BMB25Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Voltage-Max:

    2.50125 V

  • Output Voltage-Min:

    2.49875 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temp Coef of Voltage-Max:

    10 ppm/°C

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    YES

  • Width:

    3.9 mm

ISL71010BMB25Z Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the thermal path short and using a thermal pad on the top layer can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, using a thermally conductive material for the PCB and applying a thermal interface material between the device and heat sink can help to improve thermal performance.
  • To minimize EMI and RFI, it is recommended to use a shielded enclosure, keep the device and PCB away from radiating sources, and use EMI filters or chokes on the input and output lines. Additionally, using a multi-layer PCB with a solid ground plane and placing EMI-absorbing materials near the device can help to reduce EMI and RFI.
  • To troubleshoot common issues such as output voltage droop or oscillation, it is recommended to check the input voltage, output load, and PCB layout for any issues. Verify that the device is operated within its specified operating conditions, and check for any signs of overheating or electrical overstress. Use an oscilloscope to measure the output voltage and current, and consult the datasheet and application notes for troubleshooting guidelines.
  • For radiation-tolerant and high-reliability applications, it is recommended to follow the guidelines outlined in the datasheet and application notes. Use a radiation-hardened device, follow proper PCB design and layout guidelines, and ensure that the device is operated within its specified operating conditions. Additionally, consider using redundancy, error correction, and other fault-tolerant design techniques to ensure reliable operation in harsh environments.

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ISL71010BMB25Z Overview

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