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ISL81387IBZ - Renesas Electronics

Description: These devices are BiCMOS interface ICs that are user configured as either a single RS-422, RS-485 differential transceiver, or as a dual (2 Tx, 2 Rx) RS-232 transceiver. In RS-232 mode, the on-board charge pump generates RS-232 compliant ±5V Tx output levels, from a supply as low as 4.5V. Four small 0.1µF capacitors are required for the charge pump. The transceivers are RS-232 compliant, with the Rx inputs handling up to ±25V, and the Tx outputs handling ±12V. In RS-485 mode, the transceivers support both t

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ISL81387IBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M20.3
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ISL81387IBZ - Renesas Electronics  - 3D model - Small Outline Packages - M20.3
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ISL81387IBZ Details

  • Manufacturer Part Number:

    ISL81387IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    M20.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-10-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.003 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    120 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2500 ns

  • Width:

    7.5 mm

ISL81387IBZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in the ISL81387IBZ evaluation board user manual, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • To ensure reliable start-up and shutdown, it is recommended to follow the power-up and power-down sequencing guidelines provided in the datasheet, and to use a soft-start circuit to limit the inrush current during power-up.
  • The ISL81387IBZ has a high power density, so thermal management is critical. Renesas recommends using a thermal pad on the bottom of the package, and providing adequate airflow or heat sinking to keep the junction temperature below 125°C.
  • To troubleshoot I2C interface issues, check the I2C bus voltage levels, clock frequency, and signal integrity. Use an oscilloscope to verify the signal waveforms and ensure that the I2C bus is not overloaded. Also, check the device's I2C address and ensure that it is correctly configured.
  • To minimize EMI and EMC issues, Renesas recommends using a shielded layout, keeping sensitive analog signals away from digital signals, and using EMI filters or common-mode chokes on the input and output lines. Additionally, ensure that the device is properly grounded and that the PCB layout follows good EMI/EMC design practices.

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