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ISL83072EIBZA-T7A - Renesas Electronics

Description: RS-422/RS-485 Interface IC W/ANNEAL 8LD SO -40 85 3V RS-485

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ISL83072EIBZA-T7A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (8 LD SOIC)
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ISL83072EIBZA-T7A - Renesas Electronics  - 3D model - Small Outline Packages - (8 LD SOIC)
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ISL83072EIBZA-T7A Details

  • Manufacturer Part Number:

    ISL83072EIBZA-T7A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    120 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1500 ns

  • Width:

    3.9 mm

ISL83072EIBZA-T7A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, wide traces for power and ground connections.
  • Monitor the junction temperature (TJ) and ensure it stays within the recommended range of -40°C to 125°C. Also, ensure the input voltage (VIN) is within the recommended range of 2.7V to 5.5V.
  • A 1uF to 10uF ceramic capacitor (X5R or X7R dielectric) is recommended for the input capacitor (CIN). The capacitor should be placed as close to the VIN pin as possible.
  • A 1uF to 10uF ceramic capacitor (X5R or X7R dielectric) is recommended for the output capacitor (COUT). The capacitor value should be chosen based on the desired output voltage ripple and transient response.
  • A thermal pad is exposed on the bottom of the package. Connect this pad to a solid ground plane or a thermal heat sink to dissipate heat. Ensure good airflow around the device to prevent overheating.

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