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ISL83076EIBZA-T - Renesas Electronics

Description: The Intersil ISL8307XE are BiCMOS 3. 3V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125mA/-100mA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are routed to a concentra

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ISL83076EIBZA-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M14.15 Rev 1, 10/09
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ISL83076EIBZA-T - Renesas Electronics  - 3D model - Small Outline Packages - M14.15 Rev 1, 10/09
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ISL83076EIBZA-T Details

  • Manufacturer Part Number:

    ISL83076EIBZA-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    M14.15

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2018-07-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    60 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1500 ns

  • Width:

    3.9 mm

ISL83076EIBZA-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL83076EIBZA-T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and configuration of the ISL83076EIBZA-T, follow the recommended power-up sequence, which involves applying the power supply voltage (VCC) before the input voltage (VIN). Also, make sure to configure the device's registers according to the datasheet and application notes.
  • The ISL83076EIBZA-T has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the device within the recommended operating temperature range.
  • To troubleshoot issues with the ISL83076EIBZA-T, start by reviewing the datasheet and application notes to ensure proper configuration and usage. Then, use debugging tools such as oscilloscopes or logic analyzers to identify the source of the issue. Additionally, consult the device's error detection and correction mechanisms, such as the built-in error detection and correction (EDC) feature.
  • To ensure EMI and EMC compliance with regulatory standards, follow the recommended PCB layout and design guidelines, use shielding and filtering techniques, and implement proper grounding and decoupling. Additionally, consult the device's datasheet and application notes for specific EMI and EMC recommendations.

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ISL83076EIBZA-T Overview

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