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ISL83082EIBZ-T - Renesas Electronics

Description: The ISL8308xE are BiCMOS, ESD protected, 5V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each driver output, and receiver input, is protected against ±15kV ESD strikes without latch-up, and unlike competitive products, this Intersil family is specified for 10% tolerance supplies (4. 5V to 5. 5V). These devices have very low bus currents (+125µA/-75µA), so they present a true 1/8 unit load to the RS-485 bus. This allows up to 256 transceivers on the

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ISL83082EIBZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8 Ld SOIC *1
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ISL83082EIBZ-T - Renesas Electronics  - 3D model - Small Outline Packages - 8 Ld SOIC *1
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ISL83082EIBZ-T Details

  • Manufacturer Part Number:

    ISL83082EIBZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1300 ns

  • Width:

    3.9 mm

ISL83082EIBZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL83082EIBZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and configuration of the ISL83082EIBZ-T, follow the recommended power-up sequence, which involves applying the power supply voltage (VCC) before the input voltage (VIN). Also, make sure to configure the device correctly by setting the correct logic levels on the EN and SYNC pins.
  • The ISL83082EIBZ-T has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the device within the recommended operating temperature range.
  • To troubleshoot issues with the ISL83082EIBZ-T, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly configured and powered up. Use an oscilloscope to monitor the output voltage and current waveforms. Also, check for any signs of overheating or electrical overstress.
  • Yes, the ISL83082EIBZ-T is a high-frequency device, and proper EMI/EMC design considerations are essential. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Follow the recommended PCB layout and component placement guidelines to reduce EMI emissions.

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ISL83082EIBZ-T Overview

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