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ISL83387EIVZ-T - Renesas Electronics

Description: The ISL83387E is a 3. 0V to 5. 5V powered RS‑232 transceiver that meets ElA/TIA-232 and V. 28/V. 24 specifications, even at VCC = 3. 0V. Additionally, it provides ±15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS‑232 pins). Targeted applications are industrial laptop computers, Palmtops, PDAs, and notebooks where the low operational power consumption and even lower standby power consumption is critical. Efficient on‑chip charge pumps coupled with

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ISL83387EIVZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M24.173
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ISL83387EIVZ-T - Renesas Electronics  - 3D model - Small Outline Packages - M24.173
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ISL83387EIVZ-T Details

  • Manufacturer Part Number:

    ISL83387EIVZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    M24.173

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    NO

  • Driver Number of Bits:

    3

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232; V.24; V.28

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL83387EIVZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL83387EIVZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connecting the device to the power supply and load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and configuration of the ISL83387EIVZ-T, follow the recommended power-up sequence, which involves applying the power supply voltage (VCC) before the input voltage (VIN). Also, make sure to configure the device's registers according to the datasheet and application notes.
  • The ISL83387EIVZ-T has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the device within the recommended operating temperature range.
  • To troubleshoot issues with the ISL83387EIVZ-T, start by reviewing the datasheet and application notes to ensure proper configuration and usage. Then, use a logic analyzer or oscilloscope to monitor the device's signals and identify any anomalies. Finally, consult the device's errata sheet and contact Renesas support if necessary.
  • Yes, the ISL83387EIVZ-T is a high-frequency device, and proper EMI/EMC design practices are essential to ensure reliable operation. This includes using shielding, filtering, and proper PCB layout techniques to minimize electromagnetic interference.

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ISL83387EIVZ-T Overview

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