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ISL9V5045S3ST-F085C - onsemi

Description: SCIS Energy = 500mJ at TJ = 25°C; Logic Level Gate Drive; Qualified to AEC Q101; RoHS Compliant

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PCB Footprints
ISL9V5045S3ST-F085C - onsemi PCB footprint - Other - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE F_2025
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ISL9V5045S3ST-F085C Details

  • Manufacturer Part Number:

    ISL9V5045S3ST-F085C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Manufacturer Package Code:

    418AJ

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

ISL9V5045S3ST-F085C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the ISL9V5045S3ST-F085C is -40°C to 150°C.
  • To ensure reliability, follow the recommended derating guidelines, use a suitable thermal interface material, and ensure good thermal conduction to a heat sink or PCB.
  • Follow the recommended PCB layout and thermal design guidelines in the datasheet, and consider using thermal vias, thermal pads, and a heat sink to improve thermal performance.
  • Follow the recommended power sequencing and startup procedures in the datasheet, and ensure that the input voltage is stable and within the recommended range before enabling the output.
  • Follow the recommended EMI and EMC guidelines in the datasheet, and consider using shielding, filtering, and layout techniques to minimize electromagnetic interference.

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ISL9V5045S3ST-F085C Overview

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