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ISO5852SDWR - Texas Instruments

Description: TEXAS INSTRUMENTS - ISO5852SDWR - ISOLATED IGBT/MOSFET DRIVER, 5.5V, SOIC

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ISO5852SDWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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ISO5852SDWR Details

  • Manufacturer Part Number:

    ISO5852SDWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO REQUIRED VEE2 SUPPLY -15V TO 0V

  • High Side Driver:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Current-Max:

    5 A

  • Output Peak Current Limit-Nom:

    2.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.11 µs

  • Turn-on Time:

    0.11 µs

  • Width:

    7.5 mm

ISO5852SDWR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a 10nF capacitor between VCC and GND for decoupling.
  • Use a reliable communication protocol like SPI or UART, and ensure proper signal termination and shielding. Implement error-checking mechanisms like CRC or checksum to detect data corruption.
  • The maximum cable length depends on the specific application and the type of cable used. As a general guideline, the ISO5852SDWR can support cable lengths up to 10 meters (33 feet) with proper termination and shielding.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI. Ensure that the PCB layout and component placement are optimized for EMC. Follow the guidelines in the TI application note 'EMI and EMC Considerations for Isolated Devices' (SLAA701).
  • The ISO5852SDWR has a maximum junction temperature of 150°C. Ensure good airflow around the device, and use a heat sink if necessary. Follow the thermal management guidelines in the TI application note 'Thermal Management for Isolated Devices' (SLAA702).

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ISO5852SDWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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