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ISO6742FDWR - Texas Instruments

Description: Digital Isolators General-purpose, quad-channel, 2/2 digital isolator

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ISO6742FDWR - Texas Instruments - PCB symbol
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ISO6742FDWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016A
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ISO6742FDWR - Texas Instruments - 3D model - Small Outline Packages - DW0016A
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ISO6742FDWR Details

  • Manufacturer Part Number:

    ISO6742FDWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    IEC 62368-1

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ISO6742FDWR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a 10nF capacitor between VCC and GND for decoupling.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Ensure the PCB layout is optimized for EMC, and consider using a TVS diode for overvoltage protection.
  • The maximum cable length depends on the specific application and signal frequency. As a general guideline, keep the cable length below 10 meters for frequencies up to 100 kHz. For longer cables, use a repeater or a signal conditioner to maintain signal integrity.
  • Power up the device in the following sequence: VCC, then VISO. Power down in the reverse sequence: VISO, then VCC. Ensure a minimum of 10ms delay between power-up and power-down sequences to prevent latch-up.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid high ambient temperatures. Monitor the device temperature and adjust the thermal design accordingly to prevent overheating.

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ISO6742FDWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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