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ISO7142CCQDBQRQ1 - Texas Instruments

Description: Automotive, Small Footprint, Low Power, Quad-Channel 2/2 Digital Isolator

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ISO7142CCQDBQRQ1 - Texas Instruments - PCB symbol
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ISO7142CCQDBQRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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ISO7142CCQDBQRQ1 - Texas Instruments - 3D model - Small Outline Packages - DBQ0016A
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ISO7142CCQDBQRQ1 Details

  • Manufacturer Part Number:

    ISO7142CCQDBQRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    IT ALSO OPERATES AT 5V

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7142CCQDBQRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a ferrite bead or a 10uF capacitor to filter the power supply.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and ensure proper grounding and bonding. Follow the guidelines in the TI application note 'EMC Compliance for Isolated Devices' (SLAA701).
  • The maximum cable length depends on the data rate and cable quality. As a general guideline, use a cable length of up to 10 meters for data rates up to 100 Mbps, and up to 5 meters for data rates above 100 Mbps.
  • Power up the device in the following sequence: VCC, VISO, and then the input signals. Power down in the reverse sequence. Ensure a minimum of 10ms delay between power-up and signal application.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device, and avoid blocking the thermal pads. Follow the thermal management guidelines in the TI application note 'Thermal Management for Isolated Devices' (SLAA702).

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ISO7142CCQDBQRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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