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ISO7310FCDR - Texas Instruments

Description: Robust EMC, Low Power Single-Channel 1/0 Digital Isolator, Fail-safe Low

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ISO7310FCDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008B
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ISO7310FCDR - Texas Instruments  - 3D model - Small Outline Packages - D0008B
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ISO7310FCDR Details

  • Manufacturer Part Number:

    ISO7310FCDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    IEC 60950-1; IEC 60601-1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7310FCDR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the ISO7310FCDR is -40°C to 125°C.
  • To ensure reliable operation in high-noise environments, use proper PCB layout techniques, such as separating analog and digital grounds, and using shielding and filtering to minimize electromagnetic interference (EMI).
  • The recommended power-up sequence is to apply VCC first, followed by VISO, and then the input signals. This ensures proper initialization of the device.
  • The input capacitance and impedance of the ISO7310FCDR can be handled by using a buffer amplifier or a voltage follower to drive the input, and by ensuring that the input signal has a low impedance and is properly terminated.
  • The ISO7310FCDR can support data rates up to 100 Mbps, depending on the specific application and signal conditions.

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ISO7310FCDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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