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ISO7720DR - Texas Instruments

Description: High Speed, Robust EMC Reinforced Dual-Channel Digital Isolator

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ISO7720DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC-ren5
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ISO7720DR - Texas Instruments  - 3D model - Small Outline Packages - 8-Pin SOIC-ren5
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ISO7720DR Details

  • Manufacturer Part Number:

    ISO7720DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2016-11-19

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7720DR Frequently Asked Questions (FAQs)

  • The maximum data rate of the ISO7720DR is 100 Mbps, but it can be limited by the capacitance of the isolation barrier and the signal transmission frequency.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper PCB design and layout guidelines, provide adequate heat sinking, and consider the device's thermal characteristics, such as the junction-to-ambient thermal resistance (RθJA).
  • The recommended power-up sequence for the ISO7720DR is to power up the VCC1 and VCC2 supplies simultaneously, ensuring that both supplies are within 100 mV of each other during power-up and power-down.
  • To minimize the impact of input and output capacitance, use a low-capacitance PCB design, keep the signal traces short, and consider using series termination resistors to reduce signal reflections.
  • To minimize EMI and RFI, use a shielded enclosure, keep the device away from noise sources, use a low-pass filter on the input, and ensure proper grounding and shielding of the PCB.

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ISO7720DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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