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ISO7731BDWR - Texas Instruments

Description: Digital Isolators

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ISO7731BDWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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ISO7731BDWR - Texas Instruments  - 3D model - Small Outline Packages - DW0016B
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ISO7731BDWR Details

  • Manufacturer Part Number:

    ISO7731BDWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2019-02-08

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ISO7731BDWR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a 10nF capacitor between VCC and GND, and a 100nF capacitor between VCC_ISO and GND_ISO.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device. Reduce the power consumption by minimizing the output current and using a lower supply voltage. Consider using a thermally-enhanced package or a heat-spreaded QFN package.
  • The recommended input voltage range is 2.25V to 5.5V. However, the device can operate with input voltages as low as 1.8V, but with reduced performance and reliability.
  • Power up the device in the following sequence: VCC, VCC_ISO, and then the input signals. Use a power-up sequence controller or a dedicated power-up circuit to ensure a monotonic power-up sequence.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency sources, and use a common-mode choke or a ferrite bead to filter the input signals. Ensure good PCB layout practices, such as minimizing loop areas and using a solid ground plane.

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ISO7731BDWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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