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ISO7731FDBQ - Texas Instruments

Description: High-speed, robust EMC triple-channel digital isolator

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ISO7731FDBQ - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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ISO7731FDBQ - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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ISO7731FDBQ Details

  • Manufacturer Part Number:

    ISO7731FDBQ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-09-03

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    IEC 62368-1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7731FDBQ Frequently Asked Questions (FAQs)

  • The maximum data rate is 100 Mbps, but it can be limited by the capacitance of the isolation barrier and the signal integrity of the system.
  • The device has built-in transient immunity and EMI filtering, but additional external filtering may be required depending on the specific application and environment.
  • A minimum of 1.5 mm spacing between the device and other components is recommended, and a multi-layer PCB with a solid ground plane is suggested to minimize noise and EMI.
  • The device is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. Thermal management and heat sinking may be required in high-temperature applications.
  • The device has built-in power sequencing and hot swap capability, but additional external circuitry may be required to ensure safe and reliable operation.

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ISO7731FDBQ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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