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ISO7741FEDWQ1 - Texas Instruments

Description: Digital Isolators Automotive Grade 0, high-speed, robust-EMC quad-channel digital isolator 16-SOIC -40 to 150

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ISO7741FEDWQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G16)
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ISO7741FEDWQ1 - Texas Instruments  - 3D model - Small Outline Packages - DW (R-PDSO-G16)
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ISO7741FEDWQ1 Details

  • Manufacturer Part Number:

    ISO7741FEDWQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-16

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-09-08

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRE VCC2 FROM 2..2-5.5V; ALSO OPERATE WITH 3.3V AND 5 V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ISO7741FEDWQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLUA685, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended operating conditions and thermal management guidelines provided in the datasheet. Additionally, consider using thermal pads or heat sinks to dissipate heat, and ensure good airflow around the device.
  • When using the ISO7741FEDWQ1 in a system with multiple power domains, it is crucial to ensure that the device is properly isolated from each power domain to prevent voltage differences from causing damage or malfunction. Use proper isolation techniques, such as using separate power supplies or isolation transformers, and follow the guidelines provided in the datasheet.
  • To troubleshoot issues with the ISO7741FEDWQ1, start by reviewing the datasheet and application notes to ensure that the device is properly configured and used within its recommended operating conditions. Use oscilloscopes or logic analyzers to monitor the device's inputs and outputs, and check for any signs of electrical overstress or damage. If the issue persists, contact Texas Instruments' technical support for further assistance.
  • When using the ISO7741FEDWQ1 in a system with high-frequency signals or noise, it is essential to ensure that the device is properly shielded and filtered to prevent electromagnetic interference (EMI) and radio-frequency interference (RFI). Use proper shielding techniques, such as using metal enclosures or shielding materials, and follow the guidelines provided in the datasheet.

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ISO7741FEDWQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image ISO7741FEDWRQ1 Texas Instruments

DIGITAL ISOLATOR, CMOS, PDSO16