ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY
Interface IC Type:
DIGITAL ISOLATOR
JESD-30 Code:
R-PDSO-G16
JESD-609 Code:
e4
Length:
4.905 mm
Moisture Sensitivity Level:
2
Number of Channels:
6
Number of Functions:
6
Number of Terminals:
16
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SSOP
Package Equivalence Code:
SSOP16,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.75 mm
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
2.25 V
Supply Voltage-Nom:
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.635 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.895 mm
ISO7760FQDBQQ1 Frequently Asked Questions (FAQs)
A good PCB layout for the ISO7760FQDBQQ1 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. TI provides a recommended PCB layout in the application note SLAA701.
To ensure reliable communication, use a proper UART or SPI interface configuration, set the correct baud rate, and implement error checking mechanisms such as checksums or CRC. Additionally, ensure that the microcontroller and ISO7760FQDBQQ1 are properly synchronized.
The ISO7760FQDBQQ1 requires a specific power sequencing to prevent latch-up and ensure proper operation. The recommended power-up sequence is VCC, then VIO, and finally the input signals. The power-down sequence should be reversed.
To handle thermal considerations, ensure good airflow around the device, use a heat sink if necessary, and avoid overheating the device. The ISO7760FQDBQQ1 has a maximum junction temperature of 150°C, and exceeding this temperature can affect its reliability.
The ISO7760FQDBQQ1 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Use ESD-safe materials, handle the device by the body, and avoid touching the pins.
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ISO7760FQDBQQ1 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
