ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY
Interface IC Type:
DIGITAL ISOLATOR
JESD-30 Code:
R-PDSO-G16
JESD-609 Code:
e4
Length:
10.3 mm
Moisture Sensitivity Level:
2
Number of Channels:
6
Number of Functions:
6
Number of Terminals:
16
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
2.65 mm
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
2.25 V
Supply Voltage-Nom:
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
7.5 mm
ISO7760FQDWQ1 Frequently Asked Questions (FAQs)
A good PCB layout for the ISO7760FQDWQ1 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. TI provides a recommended PCB layout in the datasheet and application notes.
To ensure reliable communication, use a reliable clock source, ensure proper signal termination, and implement error detection and correction mechanisms. Additionally, follow the recommended communication protocols and timing diagrams provided in the datasheet.
To ensure EMI and EMC compliance, use proper shielding, filtering, and grounding techniques. Keep the ISO7760FQDWQ1 away from high-frequency sources, and use a common-mode choke to reduce emissions. Follow TI's application notes and guidelines for EMI and EMC compliance.
To troubleshoot issues, use a logic analyzer or oscilloscope to monitor the signal lines, check the power supply and clock signals, and verify the communication protocol and timing. Consult the datasheet and application notes for troubleshooting guidelines and FAQs.
To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and follow TI's guidelines for thermal design and layout. Monitor the device's junction temperature and adjust the system design accordingly.
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ISO7760FQDWQ1 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
