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ISO7761DBQ - Texas Instruments

Description: High Speed, Robust EMC Six-Channel Digital Isolators

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ISO7761DBQ - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - ISO7761DBQ-1
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ISO7761DBQ Details

  • Manufacturer Part Number:

    ISO7761DBQ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-01-30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    6

  • Number of Functions:

    6

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    IEC 62368-1; IEC 61010-1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7761DBQ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal pad or thermal interface material to improve heat dissipation. Ensure good airflow and avoid blocking the thermal pad. Operate within the recommended temperature range (-40°C to 125°C) and follow the recommended power-up and power-down sequences.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Ensure good grounding and use a low-pass filter on the output lines.
  • The POR and BOR features are enabled by default. Ensure that the power supply is stable and within the recommended range. Use an external reset circuit or a supervisory IC to monitor the power supply and generate a reset signal if necessary.
  • The limited slew rate can cause signal distortion and ringing. Use a series resistor or a ferrite bead to reduce the slew rate and minimize signal reflections. Ensure that the signal traces are properly terminated and matched to the load impedance.

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ISO7761DBQ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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