ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY
Interface IC Type:
DIGITAL ISOLATOR
JESD-30 Code:
R-PDSO-G16
JESD-609 Code:
e4
Length:
10.3 mm
Moisture Sensitivity Level:
2
Number of Channels:
6
Number of Functions:
6
Number of Terminals:
16
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
2.65 mm
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
2.25 V
Supply Voltage-Nom:
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
7.5 mm
ISO7761FQDWRQ1 Frequently Asked Questions (FAQs)
A good PCB layout for the ISO7761FQDWRQ1 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. TI provides a recommended PCB layout in the datasheet and application notes.
To ensure reliable communication, use a proper UART protocol, set the correct baud rate, and implement flow control (e.g., RTS/CTS) to prevent data loss. Also, ensure the microcontroller's UART pins are 5V-tolerant, as the ISO7761FQDWRQ1 operates at 3.3V.
The maximum cable length supported by the ISO7761FQDWRQ1 depends on the specific application and the type of cable used. As a general guideline, TI recommends keeping the cable length below 10 meters (33 feet) to ensure reliable communication.
The ISO7761FQDWRQ1 provides error detection and correction mechanisms, such as checksum and CRC. Implement error handling routines in your firmware to detect and recover from errors. Also, use the device's built-in fault detection and reporting features to identify and respond to faults.
The ISO7761FQDWRQ1 has a maximum junction temperature of 150°C. Ensure good thermal design practices, such as providing adequate heat sinking, using thermal vias, and keeping the device away from heat sources. Monitor the device's temperature and adjust the system design accordingly.
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ISO7761FQDWRQ1 Overview
Use the download button to access the ISO7761FQDWRQ1 schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
