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ISO7761QDBQRQ1 - Texas Instruments

Description: Digital Isolator CMOS 6-CH 100Mbps Automotive 16-Pin SSOP T/R

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ISO7761QDBQRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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ISO7761QDBQRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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ISO7761QDBQRQ1 Details

  • Manufacturer Part Number:

    ISO7761QDBQRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-12-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    6

  • Number of Functions:

    6

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7761QDBQRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as keeping the signal traces short, using a solid ground plane, and minimizing noise coupling. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable operation over the entire operating temperature range (-40°C to 125°C), it's crucial to follow proper thermal management practices, such as providing adequate heat sinking, using thermal vias, and selecting components with suitable temperature ratings. Additionally, ensure that the device is operated within its specified power dissipation limits.
  • To mitigate EMI and RFI, it's essential to follow good design practices, such as using a shielded enclosure, keeping the device away from noise sources, using ferrite beads or chokes on the power lines, and ensuring that the PCB layout is optimized for low emissions. Additionally, consider using EMI filters or shielding on the input and output lines.
  • To troubleshoot issues with the ISO7761QDBQRQ1, start by reviewing the datasheet and application notes to ensure that the device is being used within its specified operating conditions. Check the power supply, clock, and input/output signals for any anomalies. Use oscilloscopes or logic analyzers to debug the device's behavior. If the issue persists, consider consulting with Texas Instruments' technical support or seeking assistance from a qualified engineer.
  • When using the ISO7761QDBQRQ1 in a high-reliability or safety-critical application, it's essential to follow rigorous design and testing procedures to ensure the device's reliability and fault tolerance. Consider implementing redundant systems, error detection and correction mechanisms, and fail-safe defaults. Additionally, ensure that the device is used within its specified operating conditions and that all relevant safety certifications and standards are met.

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ISO7761QDBQRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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