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ISO7762FQDWQ1 - Texas Instruments

Description: Automotive, High Speed, Robust EMC Six-Channel Digital Isolators

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ISO7762FQDWQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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ISO7762FQDWQ1 - Texas Instruments  - 3D model - Small Outline Packages - DW0016B
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ISO7762FQDWQ1 Details

  • Manufacturer Part Number:

    ISO7762FQDWQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-12-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    6

  • Number of Functions:

    6

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ISO7762FQDWQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point.
  • Use a reliable communication protocol like SPI or I2C, and ensure proper signal termination and noise filtering. Also, use a common ground plane and keep the signal traces short and shielded.
  • The maximum cable length depends on the specific application and noise environment. As a general guideline, keep the cable length below 10 meters to ensure reliable communication.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI. Ensure that the PCB layout and component placement are optimized for EMC. Follow the guidelines in the TI application note 'EMI and EMC Considerations for Isolated Devices'.
  • The device has a maximum junction temperature of 150°C. Ensure good thermal conduction and convection to keep the device temperature below 125°C. Use a heat sink or thermal pad if necessary.

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ISO7762FQDWQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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