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ISO7763FDBQ - Texas Instruments

Description: High Speed, Robust EMC Six-Channel Digital Isolators

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ISO7763FDBQ - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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ISO7763FDBQ - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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ISO7763FDBQ Details

  • Manufacturer Part Number:

    ISO7763FDBQ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-01-30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    6

  • Number of Functions:

    6

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    IEC 62368-1; IEC 61010-1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.895 mm

ISO7763FDBQ Frequently Asked Questions (FAQs)

  • The maximum data rate is 100 Mbps, but it can be limited by the capacitance of the isolation barrier and the signal integrity of the system.
  • Ensure proper thermal management, use a thermally conductive material for the PCB, and follow the recommended layout and thermal design guidelines.
  • Use a multi-layer PCB, keep the signal traces short and away from the isolation barrier, and use a ground plane to reduce EMI.
  • Ensure that the VCC1 and VCC2 power supplies are powered up and down simultaneously, and that the input signals are stable before enabling the device.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals, and use a signal generator to test the device's functionality.

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ISO7763FDBQ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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